The quality of diode depends on the chip technology. At present, there are mainly two kinds of diode chip processes used in the industry: glass passivation (GPP) and acid pickling (OJ).

The GPP process structure of the diode, its chip p-n junction is under the protection of passivated glass. Glass is made by sintering and melting the glass powder at about 800 ℃, and then forming a glass layer after cooling. The glass layer and the chip are fused into one and cannot be separated by mechanical methods.

In the OJ process structure of diode, the chip p-n junction is under the protection of glue. Apply glue to protect the junction, and then cure it at a temperature of about 200 degrees to protect the p-n junction to obtain voltage. OJ's protective glue only covers the surface of p-n junction.

Comparison of glass passivation (GPP) and pickling (OJ) characteristics

Due to the different structures of glass passivation (GPP) and acid pickling (OJ) chip processes, when external forces are generated, cold and hot shocks will occur. Diodes with OJ process structure will produce air leakage due to the mismatch between protective glue and silicon wafer, resulting in a certain percentage of device failure. TVs diodes with GPP process structure have high reliability and still perform well at 150 degree HTRB; The OJ process products can only withstand HTRB of about 100 degrees.